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Series in Microelectronics
edited by Wolfgang Fichtner
George S. Moschytz
Characterisation of High
Density Substrates for Use at
2003. X, 170 pages. € 64,00.
Consumer applications operating at millimetre-wave frequencies demand for cost efficient, high volume production of high density packaging (HDP) technologies. Many thin-film and laminate based HDP alternatives exist today butonly few allow system integration at millimetre-wave frequencies. This work investigates the system constraints applying at these frequencies and presents a robustmethod for the characterisation and benchrharking of technology alternatives. A quantitative technology performance metric is.introduced and. implemented into.a virtual processing software fortechnology benchmarking. Seventeen different HDP technologies are then compared using a.77 GHz transceiver module for adaptive cruise control (ACC) as a reference application.
About the Author:
Didier Cottet received his diploma (M.S.) degree in electrical engineering from the Swiss Federal Institute of Technology (ETH), Zurich, Switzerland, in 1997. He joined the Electronics Laboratory of the ETH in 1998 as teaching and research assistant in the High Density Packaging Group. His research was focused on characterisation and modelling of thin-film and laminate substrates for high density packaging, and technology optimization for high yield microwave and millimetre-wave system integration. In 2003 he received the Dr. sc. (Ph.D.) degree from ETH Zurich.
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