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Series in Microelectronics
edited by Wolfgang Fichtner
Qiuting Huang
Heinz Jäckel
Hans Melchior
George S. Moschytz
Gerhard Tröster
Vol. 136
Didier Cottet
Characterisation of High
Density Substrates for Use at
Millimetre-Wave Frequencies
2003. X, 170
pages. € 64,00.
ISBN 3-89649-878-9
Consumer applications operating
at millimetre-wave frequencies demand for cost
efficient, high volume production of high density packaging (HDP) technologies.
Many thin-film and laminate based HDP alternatives exist today butonly few allow system integration at millimetre-wave
frequencies. This work investigates the system constraints applying at these
frequencies and presents a robustmethod for the characterisation and benchrharking
of technology alternatives. A quantitative technology performance metric is.introduced and. implemented into.a
virtual processing software fortechnology
benchmarking. Seventeen different HDP technologies are then compared using a.77
GHz transceiver module for adaptive cruise control (ACC) as a reference
application.
About the
Author:
Didier Cottet received
his diploma (M.S.) degree in electrical engineering from the Swiss Federal
Institute of Technology (ETH), Zurich, Switzerland, in 1997. He joined the
Electronics Laboratory of the ETH in 1998 as teaching and research assistant in
the High Density Packaging Group. His research was focused on characterisation and modelling of thin-film and laminate substrates
for high density packaging, and technology optimization for high yield
microwave and millimetre-wave system integration. In
2003 he received the Dr. sc. (Ph.D.) degree from ETH
Zurich.
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