Inh.: Dr. Renate Gorre
Fon: +49 (0)7533 97227
Fax: +49 (0)7533 97228
Series in Microelectronics
Lifetime Estimation of Aluminium Wire Bonds
based on Computational Plasticity.
2000. XVI, 90 pages. € 49,90
In this work the reliability of bond wire connections in insulated gate bipolar transistor (IGBT) modules is addressed. The bond wires are made of thick pure aluminum wires wedge-bonded on molybdenum strain buffers. Such an interface degrades during the operation of the module due to thermo-mechanical fatigue. Since railroad-traction applications require lifetimes of several decades a method was developed to extrapolate lifetime information obtained from accelerated lifetime tests towards field conditions. The sensitivity of the model's parameters were systematically investigated to determine their influence on the predicted lifetime. The importance of using consistent temperature-dependent material data in non-linear thermo-mechanical finite-element simulations is demonstrated. Finally, a set of guidelines is given how to assess the wire bond lifetime under different circumstances.
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